microelectronics > telecoms
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Build to Print and Custom Design modules on Ceramic, PCB or System in
a Package(SIP) BGA for Telecom markets
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Designed the worlds smallest Network Timing Module for stratum 3,OC 12
application using SIP technolgy
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Design for Manufacture and Value Engineering review
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Design expertise in high reliability communications (SLICs and COICs)
and wireless communications in ISM bands (433MHz and 2.4GHz wireless
LAN)
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Knowledge of telecom standards world wide
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Sample and stepped volume production
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High Voltage Isolation

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